The setting time of the hot melt adhesive refers to the positioning time of the hot melt adhesive and the time required for the adhesive to produce a certain strength during the curing time. The solidification time of hot melt adhesive is very important for some adherends with high elasticity and high stress. The curing time is long, the initial strength is insufficient, and the adhesive surface of the adherend will bounce.
The solidification time is affected by the various components in the hot melt adhesive and also by the ambient temperature. For example, when wax is used in components, the setting time can be shortened by using wax with high crystallinity and high melting point, and vice versa; the lower the ambient temperature, the faster the heat dissipation and the shorter the setting time