Combination of hot melt adhesive and inorganic substance


In some cases, the use of hot melt adhesives requires a certain degree of rigidity and dimensional stability, such as hot melt adhesives for caulking. However, the base material that constitutes the hot melt adhesive is generally a polymer polymer with a large expansion coefficient, which is generally more than 10 times that of ordinary metals and inorganic substances. 

In some occasions that require high dimensional stability, hot melt adhesives need to be modified. The diversified blending modification of hot melt adhesives and inorganic fillers is one of the most important methods. Using methods such as blending to disperse the inorganic filler into the polymer in nanometer size, the dimensional stability, thermal stability and rigidity of the inorganic filler can be combined with the good adhesion of the hot melt adhesive.